Method and apparatus for unpacking semiconductor wafer container

ABSTRACT

An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.

RELATED APPLICATION

This application is a divisional of U.S. application Ser. No.15/339,343, filed Oct. 31, 2016, now U.S. Pat. No. 10,840,121, theentire contents of which is incorporated herein by reference.

TECHNICAL FIELD

The disclosure relates to a semiconductor wafer manufacturing processand more particularly to semiconductor wafer container handling duringthe semiconductor manufacturing process.

BACKGROUND

It is desirable to handle and transport semiconductor wafer containersin a manner that ensures integrity of the semiconductor wafers andsafety to the handlers. Manually handling semiconductor wafer containersmay lead to semiconductor wafer breakage if the containers are nothandled properly. The semiconductor wafer containers are tightly sealedin plastic bags when transported. When processing of the semiconductorwafers stored in the semiconductor wafer containers is necessary, thesemiconductor wafer container needs to be removed from the plastic bag.To remove the semiconductor wafer container from the bag, the bag is cutopen. Manually cutting the bags can result in damage to the wafersduring the bag removal process and exposes the handler to sharp cuttingtools. An automated semiconductor wafer container unpacking process andapparatus for performing semiconductor wafer container unpacking isdesirable.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 depicts a method for unpacking a semiconductor wafer containerfrom a sealed bag according to an embodiment of the present disclosure.

FIG. 2 depicts another method for unpacking a semiconductor wafercontainer from a sealed bag according to another embodiment of thepresent disclosure.

FIG. 3 is a side view depicting a step in a method for unpacking asemiconductor wafer container from a sealed bag according to anembodiment of the present disclosure.

FIG. 4 is a side view depicting a step in a method for unpacking asemiconductor wafer container from a sealed bag according to anembodiment of the present disclosure.

FIG. 5 is a side view depicting a step in a method for unpacking asemiconductor wafer container from a sealed bag according to anembodiment of the present disclosure.

FIG. 6 is a side view depicting a step in a method for unpacking asemiconductor wafer container from a sealed bag according to anembodiment of the present disclosure.

FIG. 7 is a side view depicting a step in a method for unpacking asemiconductor wafer container from a sealed bag according to anembodiment of the present disclosure.

FIG. 8 is a top view depicting a step in a method for unpacking asemiconductor wafer container from a sealed bag according to anembodiment of the present disclosure.

FIG. 9 is a side view depicting a step in a method for unpacking asemiconductor wafer container from a sealed bag according to anembodiment of the present disclosure.

FIG. 10 is a side view depicting a step in a method for unpacking asemiconductor wafer container from a sealed bag according to anembodiment of the present disclosure.

FIG. 11 is a side view depicting a step in a method for unpacking asemiconductor wafer container from a sealed bag according to anembodiment of the present disclosure.

FIG. 12 depicts a sequential method and apparatus for unpacking asemiconductor wafer container from a sealed bag according to anembodiment of the present disclosure.

FIG. 13 depicts a method for unpacking a semiconductor wafer containershipping box from a sealed bag and unpacking a semiconductor wafercontainer from a sealed bag according to an embodiment of the presentdisclosure.

FIG. 14 depicts a semiconductor wafer container shipping box in a sealedbag.

FIG. 15 depicts semiconductor wafer containers in a semiconductor wafercontainer shipping box.

DETAILED DESCRIPTION

It is to be understood that the following disclosure provides manydifferent embodiments, or examples, for implementing different featuresof the invention. Specific embodiments or examples of components andarrangements are described below to simplify the present disclosure.These are, of course, merely examples and are not intended to belimiting. For example, dimensions of elements are not limited to thedisclosed range or values, but may depend upon process conditions and/ordesired properties of the device. Moreover, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed interposing the first and second features, suchthat the first and second features may not be in direct contact. Variousfeatures may be arbitrarily drawn in different scales for simplicity andclarity.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The device may be otherwise oriented (rotated 90 degrees orat other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly. In addition, the term“made of” may mean either “comprising” or “consisting of.”

An automated method 100 of unpacking a container containingsemiconductor wafers from a sealed bag, is illustrated in FIG. 1,according to an embodiment of the disclosure. The method includes anoperation 102 of inflating the sealed bag with a gas using an automatedgas dispenser. The semiconductor wafer container containing thesemiconductor wafers is located in the sealed bag. After inflating thebag, the bag is subjected to a cutting operation 104 using an automatedcutting device. An operation 106 of removing the cut bag from around thewafer container is subsequently performed.

An automated method 200 of unpacking a container containingsemiconductor wafers from a sealed bag, is illustrated in FIG. 2,according to another embodiment of the disclosure. The method includesan operation 202 of introducing a semiconductor wafer container sealedin a bag into an in port of an unpacking apparatus. The sealed bag isinflated with a gas during a bag inflating operation 204 using anautomated gas dispenser. After inflating the bag, the bag is subjectedto a cutting operation 206 using an automated cutting device, and anoperation 208 of removing the cut bag from around the semiconductorwafer container is subsequently performed. After removal of the cut bag,the semiconductor wafers inside the container are inspected during asemiconductor wafer inspection operation 210. After the semiconductorwafer inspection, an operation 212 of transferring the semiconductorwafer container to an out port of the semiconductor wafer containerunpacking apparatus is performed.

Additional methods and apparatuses according to the present disclosurewill be explained in reference to FIGS. 3 to 11. As shown in the sideview of FIG. 3, a semiconductor wafer container 12 containingsemiconductor wafers 20 is supported on a surface 24 of a platform 22 ofa semiconductor wafer container unpacking apparatus 10. Thesemiconductor wafer container 12 is positioned in a desired orientationby the use of sensors (not shown) and a restraining mechanism (notshown) maintains the semiconductor wafer container 12 in the desiredorientation during subsequent processing in some embodiments. Thesemiconductor wafer container 12 is sealed in a bag 18, such as animpermeable plastic bag. In some embodiments, the impermeable plasticbag is a polyethylene or a polyethylene terephthalate bag. Theimpermeable bag inhibits oxygen and water vapor transport across the bagto prevent degradation of the semiconductor wafers stored in the bag. Incertain embodiments, the bag is an anti-static bag. The anti-static bagmay be a polyethylene or a polyethylene terephthalate bag having a thinmetal layer, such as an aluminized polyethylene or polyethyleneterephthalate bag. A desiccant pack is included in the bag in someembodiments. In some embodiments, the bag is vacuum sealed. In otherembodiments, an inert gas, such as nitrogen, is introduced into the bagprior to sealing.

In some embodiments, the semiconductor wafer container 12 is deliveredto the unpacking apparatus 10 from a prior processing stage by aconveyor, including belts and rollers. In other embodiments, thesemiconductor wafer container 12 is delivered to the unpacking apparatus10 by an overhead track or by one or more robots.

The semiconductor wafer container 12 includes a base 14 and a pluralityof supports along the internal sidewalls (not shown) to support thesemiconductor wafers 20. In some embodiments, the semiconductor wafercontainer 12 contains from 1 to about 25 semiconductor wafers 20. Inother embodiments, the semiconductor wafer container 12 contains from 15to 25 semiconductor wafers 30. In some embodiments, the semiconductorwafers 20 are 200 mm diameter or 300 mm diameter semiconductor wafers.The semiconductor wafer container 12 may further include a flange 16 onthe top surface of the semiconductor wafer container 12. The flange 16is used to secure the semiconductor wafer container 12 duringprocessing. In some embodiments, the semiconductor wafer container 12 ismade of a transparent or translucent engineering plastic. In certainembodiments, the engineering plastic forming the semiconductor wafercontainer 12 is a polycarbonate or a polysulfone. In some embodiments,the semiconductor wafer container 12 is a front opening unified pod(FOUP) or a front opening shipping box (FOSB).

Adverting to FIG. 4, a frame 26, including a plurality of members, risesfrom the platform 22. The frame 26 is attached to a slide unit 62 tocontrol the up and down movement of the frame 26 in some embodiments. Insome embodiments, the frame 26 is formed of a suitable metal, such ascarbon steel, stainless steel, aluminum, or an engineering plastic. Inthis embodiment, the frame includes two members on opposing sides of thesemiconductor wafer container 12.

In some embodiments, a nozzle 28 pierces the bag 18 enclosing thesemiconductor wafer container 12. The nozzle 28 may include a sharppoint to pierce the bag 18. In certain embodiments, the nozzle 28 israised by a pneumatic cylinder 58 after the semiconductor wafercontainer 12 is properly positioned. A portion of the bottom of the base14 of the semiconductor wafer container 12 is recessed in someembodiments, thus the nozzle 28 does not contact and damage thesemiconductor wafer container 12. In other embodiments, thesemiconductor wafer container 12 is positioned on the surface 24 of theplatform 22 so that the nozzle 28 is aligned with one of a number ofslots or recesses in the bottom of the base 14.

In some embodiments, the nozzle 28 is formed of a suitable metal, suchas carbon steel, stainless steel, aluminum, or an engineering plastic.In some embodiments, two or more nozzles are used.

As shown in FIG. 5, a gas is introduced through the nozzle 28 to inflatethe bag 18. In some embodiments, 0.01 m³ to 0.1 m³ of the gas is addedto the bag 18 while inflating the bag 18. In some embodiments, anautomated gas dispenser 50 is used to supply the gas. The automated gasdispenser includes: a gas supply 52, tubing 54 to supply the gas, thenozzle 28, and a controller 56 for controlling the amount of gasdispensed to the bag 18. The gas is clean, dry air in some embodiments.In other embodiments, the gas is nitrogen or an inert gas, such ashelium, argon, or neon. In some embodiments, the pressure inside the bagmay be monitored by a pressure gauge. By the action of inflating the bag18, the bag 18 separates from the semiconductor wafer container 12forming a gap between the bag 18 and the semiconductor wafer container12.

As shown in FIG. 6, after inflating the bag, bag securing mechanisms 30on the frame 26 holds the periphery of the upper surface of the bag 18,and pull the upper surface of the bag 18 taut in some embodiments. Insome embodiments, the bag securing mechanism 30 is a claw that grabs thebag 18. In other embodiment, the bag securing mechanism 30 is a vacuumpad gripper that secures the bag 18 by the action of a vacuum.

A cutting device 32 is used to cut top surface of the bag 18, as shownin FIG. 7. The cutting device 32 can be a knife or a laser, or any othersuitable cutting device for cutting through a plastic bag. In someembodiments, the cutting device 32 is attached to a robot arm controlledby a controller. In some embodiments, the cutting device 32 forms a cut38 around the periphery of the bag 18 in the direction of the arrow, asshown in a top view of the cutting operation in FIG. 8. The cut 38 isformed at the gap between the wall of the inflated bag 18 and thesemiconductor wafer container 12. By forming the cut 38 at the gapbetween the wall of the inflated bag 18 and the semiconductor wafercontainer 12, the cutting device 32 avoids contact with thesemiconductor wafer container 12 during cutting, and thereby avoidsdamaging the semiconductor wafer container 12. In some embodiments, thecutting device 32 is a laser, including a CO₂ laser or a fiber laser. Insome embodiments, the cut 38 is formed around an entire periphery of thebag 18. In other embodiments, the cut 38 is made around a sufficientportion of the periphery so that the bag 18 can be removed in asubsequent bag removal operation. In some embodiments, the semiconductorwafer container 12 is positioned on an X-Y table, and the X-Y table ismoved relative to a stationary cutting device during the cuttingoperation. In some embodiments, a seal is not formed between the nozzle28 and the bag 18 during bag inflation. Therefore, the bag cuttingoperation should be performed in a short time period, such as less than20 seconds, in some embodiments.

The semiconductor wafer container 12 includes identifying information40, such as a barcode or a radio frequency identification (RFID) tag.The identifying information 40 contains information about the lot ofsemiconductor wafers 20 stored in the semiconductor wafer container 12.The barcode can be scanned by a barcode reader or the RFID tag can beread by an RFID reader before and after the unpacking process, and theinformation read by the reader stored in a computer controlling theunpacking operation in some embodiments.

After the top surface of the bag 18 is cut, the cut top surface of thebag 18 can be removed by a robot, and the bag 18 is removed from aroundthe semiconductor wafer container 12 in some embodiments. The robot canhave a claw or a vacuum pad gripper to secure the top surface of the bagduring removal. In certain embodiments, the top surface of the bag 18 isheld by the robot during the cutting operation.

In some embodiments, other surfaces of the bag 18 are cut. For example,in a certain embodiment, a side of the bag 18 facing a front door of aFOUP is cut in addition to the top surface of the bag 18. In otherembodiments, a side of the bag 18 facing any of the six major outersurfaces of the semiconductor wafer container 12 are cut during thecutting operation.

After the cutting operation is completed, the gas supply is shut off,the nozzle 28 retracts, and the bag 18 is pulled down around thesemiconductor wafer container by the action a bag removing mechanism 60in some embodiments. The bag removing mechanism 60 includes the bagsecuring mechanism 30, the frame 26, and the slide unit 62. The bagsecuring mechanism 30 securing the bag 18 and the frame 26 retract downbelow the surface 24 of the platform 22 by the action of the slide unit62 connected to the frame 26 in some embodiments, as shown in FIG. 9. Incertain embodiments, the semiconductor wafer container 12 is held by aholding mechanism 42 during the bag removal. The holding mechanism 42may secure the semiconductor wafer container 12 by engaging a flange 16on the top of the semiconductor wafer container 12 after cutting the topsurface of the bag 18 to expose the flange 16 in certain embodiments.The flange 16 may also be used to secure the semiconductor wafercontainer 12 to a semiconductor wafer container transport system such asan overhead track or a robot. After removal of the bag 18, thesemiconductor wafer container 12 and the semiconductor wafers 20 thereinare ready to undergo further processing, as shown in FIG. 10.

In certain embodiments, after the bag is removed the semiconductor wafercontainer 12 is transported to an inspection stage. As shown in FIG. 11,the semiconductor wafer container 12 is transported to an inspectionstage 44 of a semiconductor wafer containing unpacking apparatus 10. Thesemiconductor wafer container 12 may undergo optical inspection at theinspection stage 44. For example, in some embodiments, the semiconductorwafer container 12 is placed on a turntable 34 on a platform 22 androtated while a camera 36 optically inspects the semiconductor wafers 20looking for defects. The defects may include breaks and chips along thewafer 20 edges. The results of the inspection are input to a data fileassociated with the particular semiconductor wafer container 12. Ifdefects are discovered, the data file is flagged and a semiconductorwafer unpacking apparatus operator is notified.

A method and an apparatus according to another embodiment of the presentdisclosure is explained in reference to FIG. 12. An apparatus forunpacking a semiconductor wafer container 300 is illustrated. Asemiconductor wafer container 302 containing semiconductor wafers sealedin a bag 304 is transported to an in port stage 306 where identifyinginformation about the semiconductor wafer container 302 and its contentsare read by an information reader 324. The identifying information maybe in any suitable form, such as a barcode attached to the semiconductorwafer container 302 or an RFID tag attached to or inside thesemiconductor wafer container 302. The information reader 324 may be abarcode reader, an RFID tag scanner, or any other suitable device asnecessary to read the identifying information about the semiconductorwafer container 302 and the semiconductor wafers contained therein. Incertain embodiments, the in port stage 306 includes a semiconductorwafer container mechanism (not shown), to properly position thesemiconductor wafer container 302 for subsequent processing operations.

In some embodiments, the semiconductor wafer container 302 contains from1 to about 25 semiconductor wafers. In certain embodiments, thesemiconductor wafer container 302 contains 15 to 25 semiconductorwafers. In some embodiments, the semiconductor wafers contained in thesemiconductor wafer container 302 are 200 mm diameter or 300 mm diametersemiconductor wafers.

In some embodiments, the semiconductor wafer container 302 is a frontopening unified pod (FOUP) or a front opening shipping box (FOSB). Insome embodiments, the semiconductor wafer container 302 is made of atransparent or translucent engineering plastic. In certain embodiments,the engineering plastic forming the semiconductor wafer container 302 isa polycarbonate or a polysulfone. In some embodiments, the bag 304 is animpermeable transparent or translucent plastic bag. In some embodiments,the impermeable plastic bag 304 is a polyethylene or a polyethyleneterephthalate bag. In certain embodiments, the plastic bag 304 is ananti-static bag. The plastic anti-static bag 304 may be a polyethyleneor a polyethylene terephthalate bag having a thin metal layer, such asan aluminized polyethylene or polyethylene terephthalate bag. Adesiccant pack is included in the bag 304 in some embodiments.

The bag may be evacuated and heat sealed after the semiconductor wafercontainer is placed inside the bag. In certain embodiments, the bag 304is formed of a shrink wrap material, which conforms to the semiconductorwafer container upon shrinking after the semiconductor wafer is placedinside the bag.

After the in port stage 306, the next stage is a bag inflating stage308. The bag 304 is inflated by injecting a gas through one or morenozzles (not shown). In some embodiments, 0.01 m³ to 0.1 m³ of the gasis added to the bag 304 while inflating the bag 304. The gas is clean,dry air in some embodiments. In other embodiments, the gas is nitrogenor an inert gas, such as helium, argon, or neon. In certain embodiments,the gas pressure in the bag 304 is monitored by a pressure gauge. By theaction of inflating the bag 304, the bag 304 separates from thesemiconductor wafer container 302 forming a gap between the bag 304 andthe semiconductor wafer container 302.

Following the bag inflating stage 308, is a bag cutting stage 310. Inthe bag cutting stage 310, a cut 326 is made around a periphery of thebag 304 using a cutting device, such as a knife or a laser, or any othersuitable device for cutting through a plastic bag. In some embodiments,the cut 326 is formed at the gap between the wall of the inflated bag304 and the semiconductor wafer container 302. By forming the cut 326 atthe gap between the wall of the inflated bag 304 and the semiconductorwafer container 302, the cutting device avoids contact with thesemiconductor wafer container 302 during cutting, and thereby avoidsdamaging the semiconductor wafer container 302. In some embodiments, thecutting device is attached to a robot controlled by a controllerprogrammed to carry out the cutting operation. In other embodiments, thesemiconductor wafer container 302 is placed on an X-Y table, and the X-Ytable is moved relative to a stationary cutting device during thecutting operation.

After the bag 304 is cut, the bag 304 is removed from around thesemiconductor wafer container 302 at a bag removal stage 312. The bagcan be removed by a bag securing mechanism attached to a slide unit,which secures the bag and pulls the cut bag away from the semiconductorwafer container. In some embodiments, the bag securing mechanism is aclaw, which grasps the bag. In other embodiments, the bag securingmechanism is a vacuum pad gripper. In some embodiments, the cut bag ispicked up at a bag pick up stage 314 by a robot controlled by acontroller programmed to carry out the bag pick up. In certainembodiments, the robot has claws or to grab the bag. In otherembodiments, the robot grasps and transports the bag using a vacuum.

The cut bags 304 are subsequently transported to a compactor stage 316including a trash compactor 318 using a slide unit or a robot in certainembodiments, where the bags 304 are subsequently compacted for recyclingor disposal. In certain embodiments, the compactor stage 316 includes asensor for sensing when the trash compactor 318 is full. Meanwhile, thesemiconductor wafer container 302 is transported to an inspection stage320 where the semiconductor wafer container 302 and the semiconductorwafers contained therein undergo inspection. In the illustratedembodiment, the semiconductor wafer container 302 and semiconductorwafers contained therein undergo an optical inspection using a camera328. The camera 328 looks for any visual defects in the semiconductorwafers. The defects may include breaks and chips along the wafer edges.The inspection data recorded by the camera 328 is stored in a computerconfigured to analyze the optical data and determine whether any of thesemiconductor wafers are defective in some embodiments. The results ofthe semiconductor wafer inspection are input to a data file associatedwith the particular semiconductor wafer container 302 identified in thein port stage 306. If one or more defects in the semiconductor wafers isfound, the data file is flagged with an appropriate warning and asemiconductor wafer unpacking apparatus operator is notified of the oneor more defects, in certain embodiments.

When the trash compactor 318 is full, an alarm is generated to notifythe semiconductor wafer container unpacking apparatus operator that thetrash compactor 318 needs to be emptied, in some embodiments. In otherembodiments, the trash compactor 318 is emptied automatically when thesensor senses the trash compactor 318 is full.

In certain embodiments, the final stage of the unpacking apparatus 300is the out port stage 322 after the inspection stage 320. In the outport stage, the identifying information of the semiconductor wafercontainer is read by an information reader 324, such as a barcode readeror an RFID tag scanner, as necessary to read the identifying informationabout the semiconductor wafer container 302 and the semiconductor waferscontained therein. The semiconductor wafer container 302 is then routedto a subsequent processing stage or processing operation. Thesemiconductor wafer container 302 can be transported by robot, overheadtrack, conveyor belt, or any other suitable transport mechanisms.

In another embodiment of the disclosure, an automated method 400 ofunpacking a semiconductor wafer container shipping box from a sealed bagand unpacking a semiconductor wafer container from a sealed bag, isillustrated in FIG. 13. The method includes an operation 402 ofintroducing a semiconductor wafer container shipping box sealed in a bagcontaining a semiconductor wafer container sealed in a bag into an inport of an unpacking apparatus. The sealed bag is inflated with a gasduring a bag inflating operation 404 using an automated gas dispenser.After inflating the bag, the bag is subjected to a cutting operation 406using an automated cutting device, and an operation 408 of removing thecut bag from around the semiconductor wafer container shipping box issubsequently performed. After removal of the cut bag, an operation 410of opening the shipping box is performed. An operation 412 of removingthe semiconductor wafer container sealed in a bag from the semiconductorwafer container shipping box is subsequently performed. The sealed bagcontaining the semiconductor wafer container is inflated with a gasduring a bag inflating operation 414 using an automated gas dispenser.After inflating the bag, the bag is subjected to a cutting operation 416using an automated cutting device, and an operation 418 of removing thecut bag from around the semiconductor wafer container is subsequentlyperformed.

FIG. 14 depicts a semiconductor wafer container shipping box 70 in asealed bag 72. The shipping box 70 can be formed of any suitablematerial, such as cardboard. The semiconductor wafer container shippingbox is sealed in a bag 72, such as an impermeable plastic bag, aspreviously described herein. The sealed bag 72 is removed from thearound the shipping box 70 in the same manner as the sealed bag 18 isremoved from semiconductor wafer container 12 previously describedherein. In certain embodiments, the same unpacking apparatus 10 is usedto remove both the sealed bag 72 from around the shipping box 70 and toremove the sealed bag 18 from around the semiconductor wafer container12.

FIG. 15 depicts a plan view of semiconductor wafer containers 12 in asemiconductor wafer container shipping box 72. The individualsemiconductor wafer containers 12 are sealed in bags 18. A divider 74separates adjacent semiconductor wafer containers 12. In someembodiments, packing material surrounds the semiconductor wafercontainers 12 to cushion the containers 12 and protect the containers 12from damage from handling during transit. After removing the sealedsemiconductor wafer containers 12 from the shipping box 72, thesemiconductor wafer containers 12 are unpacked from the sealed bags 18,as previously described herein.

Improved wafer yield is achieved by unpacking wafer containers fromsealed bags using an automated unpacking method and apparatus accordingto embodiments of the present disclosure. Improved wafer yield is alsoachieved by unpacking wafer container shipping boxes from sealed bagsusing an automated unpacking method and apparatus according toembodiments of the present disclosure. By eliminating manual handling ofthe wafer container shipping boxes and wafer containers during unpackingthe possibility of dropping the shipping box or wafer container andbreaking wafers is reduced. Also, the contacting of the semiconductorwafer container by sealed bag cutting devices is prevented, therebypreventing damage to the semiconductor wafer container by the cuttingdevices. Further, the safety of the operators is improved, as operatormanual handling of sharp tools for cutting the sealed bag to remove theshipping box or wafer container is eliminated. In addition, efficiencyis improved during wafer processing as operator positions are eliminatedby the automated unpacking of the shipping box and wafer container.

In an embodiment of the present disclosure, an automated method ofunpacking a container containing semiconductor wafers from a sealed bagis provided. The method includes inflating the bag with a gas using anautomated gas dispenser. After inflating the bag, the bag is cut usingan automated cutting device to expose the container, and the cut bag isremoved from around the container.

In another embodiment of the present disclosure, an apparatus forunpacking a container containing semiconductor wafers from a sealed bagis provided. The apparatus includes a platform for supporting thecontainer and a nozzle for inserting gas into the sealed bag. A cuttingdevice cuts the sealed bag, and a bag removing mechanism removes thebag.

In another embodiment of the present disclosure, an apparatus forunpacking a container from a sealed bag is provided. The container is afront opening unified pod or a front opening shipping box containing 200mm or 300 mm semiconductor wafers. The apparatus includes a platform forsupporting the container and a nozzle for inserting gas into the sealedbag. A cutting device cuts the sealed bag and a bag removing mechanismremoves the bag. An inspection stage inspects the wafers in thecontainer, and a compactor compacts the bag removed from the container.

The foregoing outlines features of several embodiments or examples sothat those skilled in the art may better understand the aspects of thepresent disclosure. Those skilled in the art should appreciate that theymay readily use the present disclosure as a basis for designing ormodifying other processes and structures for carrying out the samepurposes and/or achieving the same advantages of the embodiments orexamples introduced herein. Those skilled in the art should also realizethat such equivalent constructions do not depart from the spirit andscope of the present disclosure, and that they may make various changes,substitutions, and alterations herein without departing from the spiritand scope of the present disclosure.

What is claimed is:
 1. An apparatus for unpacking a container containingsemiconductor wafers from a sealed bag, comprising: a platform forsupporting the container; a nozzle for inserting gas into the sealedbag; a cutting device for cutting the sealed bag, wherein the cuttingdevice is a laser; and a bag removing mechanism for removing the bag. 2.The apparatus of claim 1, wherein the container is a front openingunified pod or front opening shipping box containing 200 mm or 300 mmsemiconductor wafers.
 3. The apparatus of claim 1, further comprising adata reader for identifying information corresponding to the containerand/or the wafers, and the container includes the identifyinginformation.
 4. The apparatus of claim 1, further comprising a compactorfor compacting the bag removed from the container.
 5. The apparatus ofclaim 1, further comprising an inspection stage for inspecting thewafers in the container.
 6. The apparatus of claim 5, wherein theinspection stage includes a camera.
 7. The apparatus of claim 5, whereinthe inspection stage includes a turntable to rotate the container duringthe inspecting the wafers.
 8. The apparatus of claim 1, wherein theapparatus includes a holding mechanism for holding the container whilethe bag is removed.
 9. An apparatus for unpacking a container from asealed bag, wherein the container is a front opening unified pod or afront opening shipping box containing 200 mm or 300 mm semiconductorwafers, comprising: a platform for supporting the container; a nozzlefor inserting gas into the sealed bag; a cutting device for cutting thesealed bag; a bag removing mechanism for removing the bag; an inspectionstage for inspecting the wafers in the container; a compactor forcompacting the bag removed from the container; an information readerconfigured to read information about wafers stored in the container; anda computer configured to control the unpacking and to store theinformation about wafers stored in the container.
 10. The apparatus ofclaim 9, wherein the inspection stage includes a camera.
 11. Theapparatus of claim 9, wherein the inspection stage includes a turntableto rotate the container during the inspecting the wafers.
 12. Theapparatus of claim 9, wherein the apparatus includes a holding mechanismfor holding the container while the bag is removed.
 13. The apparatus ofclaim 9, wherein the cutting device is a laser or a knife.
 14. Anapparatus for unpacking a container containing semiconductor wafers froma sealed bag, comprising: a platform for supporting the container; anozzle for inserting gas into the sealed bag; a cutting device forcutting the sealed bag; and a bag removing mechanism for removing thebag, wherein the bag removing mechanism comprises: a frame; a bagsecuring mechanism attached to the frame; and a slide unit attached tothe frame, wherein the bag securing mechanism and frame are configuredto retract below a surface of the platform by an action of the slideunit.
 15. The apparatus of claim 14, wherein the container is a frontopening unified pod or front opening shipping box containing 200 mm or300 mm semiconductor wafers.
 16. The apparatus of claim 14, furthercomprising a data reader for identifying information corresponding tothe container and/or the wafers, and the container includes theidentifying information.
 17. The apparatus of claim 14, furthercomprising a compactor for compacting the bag removed from thecontainer.
 18. The apparatus of claim 14, further comprising aninspection stage for inspecting the wafers in the container.
 19. Theapparatus of claim 18, wherein the inspection stage includes a camera.20. The apparatus of claim 18, wherein the inspection stage includes aturntable to rotate the container during the inspecting the wafers.